Precision Dispensing Controller KDC2500/KDC2200

Description

The KDC series has an inherent advantage in ultra-precision micro-flow dispensing and automatic unmanned productior
lines; by virtue of excellent performance and advanced algorithms, it can achieve ultra-precision dispensing of minimum
0.01mg and high-speed dispensing with cycle time below 0.1s. It plays an unrivalled role in various manufacturing processessuch as semiconductor, MEMS and precision electronics.
The experience-based active compensation and real-time compensation functions bring high-stability and high-efficiencyprecision dispensing quality control to automatic product lines, meeting the requirements on ultra-precision dispensingprocesses.

Features and Advantages

* Automatic level compensation
The deviation of glue amount caused by the leveldifference is eliminated, realizing stable dispensingand avoiding poor operation.
◆ Automatic negative pressure compensatior
The automatic suck-back pressure control can
effectively prevent glue dripping and help eliminatebubbles to ensure stable dispensing.
◆ Automatic remaining amount warning
By accurately detecting the remaining glue amount inthe syringe and comparing it with the set threshold,you are reminded to replace the syringe in time to
avoid poor operation caused by lack of glue.

Process Difficulties

For such process applications as semiconductor chip
packaging and MEMS in which solder paste/silver paste isused to achieve conductive connection, common valveshave problems such as low efficiency or high mainte-
nance costs for consumables. Especially mainstream 5#and 6# solder balls are easily broken by shock and thusblock the nozzle.
• When a conventional pneumatic dispensing controller isused in the above process applications, its slow outputair pressure response and low pressure stabillity, etc. leadto relatively poor dispensing consistency.
÷ The KDC series controller with high-precision needles carperfectly solve the above problems.

Application Fields

Structural Part Bonding for Chip Inductor    VCM Part Bonding    Lens Compression Ring Bonding

MEMS Solder Paste Dispensing    CCM AA Process      Conductive Silver Paste Dispensing for MobilePhone Screen and 3D Touch UV Gluing

Technical Specifications